Semitool's Home Page

	Copper Interconnect Semitool’s Copper Damascene RAIDER for 32nm structures.

	FEOL Surface Preparation FEOL single wafer cleaning for non-damaging processing

	High Volume Packaging - Solder & TSV ECD Semitool’s new HVM RAIDER-S for Cu-TSV and Micro-Bump WLP ...

	Surface Preparation BEOL cleans Precise, repeatable control of all SP processing parameters.

	Applied Materials Completes Acquisition of Semitool December 21, 2009


	Applied Materials to Acquire Semitool November 17, 2009


	Semitool Records $71.7 Million in Fourth Quarter Bookings October 06, 2009


	Semitool Unveils Raider-S ™ for Cu-TSV September 30, 2009

Copper Interconnect